1/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. secondary ldo regulators dual output secondary fixed output ldo regulators BA3258HFP, ba33d15 hfp, ba33d18hfp description the BA3258HFP, ba33d15hfp, ba33d18hfp are fixed 2-output low-sa turation regulators with a voltage accuracy at both outputs of ? 2%. these series incorporate both overcurrent protection and thermal shutdo wn (tsd) circuits in order to prevent damage due to output short-circuiting and overloading, respectively. features 1) output voltage accuracy: ? 2%. 2) output current capacity: 1a (BA3258HFP), 0.5a (ba33d series) 3) a ceramic capacitor can be used to pr event output oscillation (BA3258HFP). 4) high ripple rejection (ba33d series) 5) built-in thermal shutdown circuit 6) built-in overcurrent protection circuit applications fpds, tvs, pcs, dsps in dvds and cds product lineup part number output voltage vo1 output voltage vo2 current capability io1 current capability io2 package BA3258HFP 3.3 v 1.5 v 1 a 1 a hrp5 ba33d15hfp 3.3 v 1.5 v 0.5 a 0.5 a hrp5 ba33d18hfp 3.3 v 1.8 v 0.5 a 0.5 a hrp5 absolute maxi mum ratings BA3258HFP ba33d series parameter symbol ratings unit parameter symbol ratings unit applied voltage v cc 15 *1 v applied voltage v cc 18 *1 v power dissipation pd 2300 *2 mw power dissipation pd 2300 *2 mw operating temperature range t opr ? 30 to 85 operating temperature range t opr ? 25 to 105 ambient storage temperature t stg ? 55 to 150 ambient storage temperature t stg ? 55 to 150 maximum junction temperature t jmax 150 maximum junction temperature t jmax 150 *1 must not exceed pd *2. derated at 18.4 mw/ at ta>25 when mounted on a glass epoxy board (70 mm ? 70 mm ? 1.6 mm) recommended operating conditions BA3258HFP ba33d series parameter symbol ratings unit parameter symbol ratings unit min. typ. max. min. typ. max. input power supply voltage v cc 4.75 - 14.0 v input power supply voltage v cc 4.1 - 16.0 v 3.3 v output current io1 - - 1 a 3.3 v output current io1 - - 0.5 a 1.5 v output current io2 - - 1 a 1.5v output current io2 - - 0.5 a 1.8 v output current io2 - - 0.5 a no.11026ebt01
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 2/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. electrical characteristics BA3258HFP (unless otherwise specified, ta = 25 , vcc = 5 v) parameter symbol limits unit conditions min. typ. max. bias current ib - 3 5 ma io1 = 0 ma, io2 = 0 ma [3.3 v output block] output voltage1 vo1 3.234 3.300 3.366 v io1 = 50 ma minimum output voltage difference 1 ? vd1 - 1.1 1.3 v io1 = 1 a, vcc = 3.8 v output current capacity 1 io1 1.0 - - a ripple rejection 1 r.r.1 46 52 - db f=120 hz,ein=0.5vp-p,io1=5ma input stability 1 reg.i1 - 5 15 mv vcc = 4.75 14 v, io1 = 5 ma load stability 1 reg.l1 - 5 20 mv io1 = 5 ma 1a temperature coefficient of output voltage 1 *3 tcvo1 - ? 0.01 - %/ io1 = 5 ma, tj = 0 to 85 [1.5 v output block] output voltage 2 vo2 1.470 1.500 1.530 v io2 = 50 ma output current capacity 2 io2 1.0 - - a ripple rejection 2 r.r.2 46 52 - db f=120 hz,ein=0.5vp-p,io2=5ma input stability 2 reg.i2 - 5 15 mv vcc = 4.1 14 v, io2 = 5 ma load stability 2 reg.l2 - 5 20 mv io2 = 5 ma 1 a temperature coefficient of output voltage 2 *3 tcvo2 - ? 0.01 - %/ io2 = 5 ma, tj = 0 to 125 *3: design is guaranteed within these paramete rs. (no total shipment inspection is made.) ba33d series (unless otherwise specified, ta = 25 , vcc = 5 v) parameter symbol limits unit conditions min. typ. max. bias current ib - 0.7 1.6 ma io1 = 0 ma, io2 = 0 ma [3.3v output block] output voltage 1 vo1 3.234 3.300 3.366 v io1 = 250 ma minimum output voltage difference 1 ? vd1 0.25 0.50 v io1 = 250 ma, vcc = 3.135 v output current capacity 1 io1 0.5 - - a ripple rejection 1 r.r.1 - 68 - db f=120 hz,ein =1vp-p,io1=100ma input stability 1 reg.i1 - 5 30 mv vcc=4.1v 16v,io1=250ma load stability 1 reg.l1 - 30 75 mv io1= 0 ma 0.5 a temperature coefficient of output voltage 1 *3 tcvo1 - ? 0.01 - %/ io1 = 5 ma, tj=0 to 125 ba33d15hfp vo2 output [1.5v output block] output voltage 2 vo2 1.470 1.500 1.530 v io2 = 250 ma output current capacity 2 io2 0.5 - - a ripple rejection 2 r.r.2 - 74 - db f=120 hz,ein=1vp-p,io2=100ma input stability 2 reg.i2 - 5 30 mv vcc =4.1v 16 v,io2=250ma load stability 2 reg.l2 - 30 75 mv io2 = 0 ma 0.5a temperature coefficient of output voltage 2 *3 tcvo2 - ? 0.01 - %/ io2 = 5 ma,tj = 0 to 125 ba33d18hfp vo2 output [1.8v output block] output voltage 2 vo2 1. 764 1.800 1.836 v io2=250 ma output current capacity 2 io2 0.5 - - a ripple rejection 2 r.r.2 - 72 - db f =120hz,ein =1vp-p,io2=100ma input stability 2 reg.i2 - 5 30 mv vcc = 4.1v 16v,io2=250ma load stability 2 reg.l2 - 30 75 mv io2 = 0 ma 0.5 a temperature coefficient of output voltage 2 *3 tcvo2 - ? 0.01 - %/ io2 = 5 ma, tj = 0 to 125 *3: design is guaranteed within these paramete rs. (no total shipment inspection is made.)
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 3/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. fig. 4 input stability (3.3 v output with no load) fig. 5 input stability (1.5 v output with no load) fig.1 circuit current (with no load) fig. 6 load stability (3.3 v output) fig. 7 load stability fig. 8 i/o voltage difference (3.3 v output) (vcc = 3.8 v, io1 = 0 ? 1 a) fig. 9 r.r. characteristics (ein = 0.5 vp-p, io = 5 ma) fig. 10 output voltage vs temperature (3.3 v output) fig. 11 output voltage vs temperature (1.5 v output) fig. 12 circuit current vs temperature (io = 0 ma) fig. 2 circuit current vs load current io2 (io1 = 0 ?1 a) fig. 3 circuit current vs load current io2 (io2 = 0 ? 1 a) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 output current io2 a output voltage vo2 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.2 0.4 0.6 0.8 1.0 output current io1 a input /output voltage difference: vd [v] 3.245 3.255 3.265 3.275 3.285 3.295 3.305 3.315 3.325 -30-150 1530 4560 75 temperature ta ? output voltage vo1 v 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -30-150 1530456075 temperature ta ? circuit current ib ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 02468101214 supply voltage vcc v output voltage vo1 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 02468101214 supply voltage vcc v output voltage vo2 v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 2.0 2.5 output current io1 a output voltage vo1 v 1.490 1.492 1.494 1.496 1.498 1.500 1.502 1.504 1.506 -30-150 1530456075 temperature ta ? output voltage vo2 v 0 10 20 30 40 50 60 70 80 10 100 1000 10000 frequency f hz ripple rejection r.r. db BA3258HFP electrical characteristics curves (unless otherwise specified, ta = 25 , vcc = 5v) r.r.(3.3 v output) 0 1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 output current io1 a circuit current ib ma 0 1 2 3 4 5 0.0 0.2 0.4 0.6 0.8 1.0 output current io2 a circuit current ib ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 10 12 14 supply voltage vcc v circuit current icc ma r.r.(1.5 v output)
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 4/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. 250 350 450 550 650 750 850 950 1050 -25-515 35557595 temperature ta ? circuit current icc ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 output current io1 a output voltage v out v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 2 4 6 8 1012141618 supply voltage vcc v circuit current icc ma 0 5 10 15 20 25 30 35 40 0.0 0.1 0.2 0.3 0.4 0.5 output current io1 a circuit current icc ma 0 5 10 15 20 25 30 35 40 0.0 0.1 0.2 0.3 0.4 0.5 output current io2 a circuit current icc ma 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 2 4 6 8 1012141618 supply voltage vcc v output voltage vo1 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 2 4 6 8 10 12 14 16 18 supply voltage vcc v output voltage vo2 v 0.0 0.1 0.2 0.3 0.4 0.5 0.0 0.1 0.2 0.3 0.4 0.5 output current io1 a input/output voltage difference vd v 3.15 3.20 3.25 3.30 3.35 3.40 3.45 -25-105 203550658095 temperature ta ? output voltage vo1 v 1.40 1.45 1.50 1.55 1.60 -25-10 5 20 3550 658095 temperature ta ? output voltage vo2 v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 output current io1 a output voltage v out v 0 10 20 30 40 50 60 70 80 100 1000 10000 frequency f hz ripple rejection r.r. db ba33d15hfp electrical characteristics curves (unless otherwise specified, ta = 25 , vcc = 5v) fig. 14 circuit current vs load current io1 (io1 = 0 ? 500 ma) fig. 13 circuit current (with no load) fig. 16 input stability (3.3 v output, io1 = 250 ma fig. 17 input stability (1.5 v output, io2 = 250 ma) fig. 18 load stability (3.3 v output) fig. 19 load stability (1.5 v output) fig. 20 i/o voltage difference (vcc = 3.135 v, 3.3 v output) fig. 21 r.r. characteristics (ein = 1 vp-p, io = 100 ma) vo2 ( 1.5v out p ut ) vo1 ( 3.3v out p ut ) fig. 22 output voltage vs temperature (3.3 v output) fig. 23 output voltage vs temperature (1.5 v output) fig. 24 circuit current vs temperature (io = 0 ma) fig. 15 circuit current vs load current io2 (io2 = 0 ? 500 ma)
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 5/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. block diagrams / standard example application circuits BA3258HFP ba33d series pin no. pin name function 1 vcc power supply pin 2 n.c. n.c. pin 3 gnd gnd pin 4 vo1 3.3 v output pin 5 vo2 1.5 v/1.8 v output pin fin gnd gnd pin *the n.c. pin is not electrically connected internally input / output equivalent circuits BA3258HFP ba33d series fig. 27 BA3258HFP input / output equi valent circuit fig. 28 ba33d series equivalent circuit pin no. pin name function 1 vcc power supply pin 2 v 02 _s output voltage monitor pin 3 gnd gnd pin 4 vo2 1.5 v output pin 5 vo1 3.3 v output pin fin gnd gnd pin vcc vo2 vo2_s vcc vo1 v ref current limit thermal shutdown current limit v o1 v o2 gnd 3.3v 1 f 1.5v 1 f 3.3 f v in c o1 c o2 c in 1 2 5 4 fin v 02 _s vcc 3 gnd pin external capacitor setting range vcc (1 pin) approximately 3.3f vo1 (5 pin) 1f to 1000f vo2 (4 pin) 1f to 1000f pin external capacitor setting range vcc (1 pin) approximately 3.3f vo1 (4 pin) 10f to 1000f vo2 (5 pin) 10f to 1000f fig.25 BA3258HFP block diagram top view hrp5 1 2 3 4 5 top view hrp5 1 2 3 4 5 reference voltage current limit sat. prevention current limit sat. prevention thermal shut down gnd(fin) vcc vcc vcc vcc vcc vo2 gnd vo1 n.c. 1 2 3 4 5 1 f co co 10 f 10 f fig.26 ba33d series block diagram vcc vo1/vo2
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 6/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. thermal design if the ic is used under excessive power dissipation conditions , the chip temperature will rise, which will have an adverse effect on the electrical characteristics of the ic, such as a reduction in current ca pability. furthermore, if the temperature exceeds t jmax , element deterioration or damage may occur. implement proper thermal designs to ensure that the power dissipation is within the permissible range in order to prevent instantaneous ic damage resulting from heat and maintain the reliability of the ic for long-term operation. refer to the power derating characteristics curves in fig. 29. ? power consumption (pc) calculation method ? power consumption of 3.3v power transistor: pc1 = (vcc ? 3.3) ? io1 ? power consumption of vo2 power transistor: pc2 = (vcc ? vo2) ? io2 ? power consumption due to circuit current: pc3 = vcc ? icc pc = pc1 + pc2 + pc3 refer to the above and implement proper thermal designs so that the ic will not be used under excessive power dissipation conditions under the entire op erating temperature range. ? calculation example (ba33d15hfp) example: vcc = 5v, io1 = 200ma, and io2 = 100ma ? power consumption of 3.3v power transistor: pc1 = (vcc ? 3.3) ? io1 = (5 ? 3.3) ? 0.2 = 0.34w ? power consumption of 1.5v power transistor: pc2 = (vcc ? 1.5) ? io2 = (5 ? 1.5) ? 0.2 = 0.35w ? power consumption due to circuit current: pc3 = vcc ? icc = 5 ? 0.0085 = 0.0425 (w) (see figs. 14 and 15) implement proper thermal designs taking into consi deration the dissipation at full power consumption (i.e., pc1 + pc2 + pc3 = 0. 34 + 0.35 + 0.0425 = 0.7325w). explanation of external components BA3258HFP 1) pin 1 (vcc pin) connecting a ceramic capacitor with a capacitance of approximately 3.3 ? f between vcc and gnd as close to the pins as possible is recommended. 2) pins 4 and 5 (vo pins) insert a capacitor between the vo and gnd pins in order to prevent output oscillation. the capacitor may oscillate if the capacitance changes as a result of temperature fluctuati ons. therefore, it is recommended that a ceramic capacitor with a temperature coefficient of x5r or above and a maximum capacitance change (resulting from temperature fluctuations) of ? 10% be used. the capacitance should be between 1 ? f and 1,000f. (refer to fig. 30) ba33d series 1) pin 1 (vcc pin) insert a 1? f capacitor between vcc and gnd. the capacitance wi ll vary depending on the application. check the capacitance with the application set and implement designing with a sufficient margin. 2) pins 4 and 5 (vo pins) insert a capacitor between the vo and gnd pins in order to prevent oscillation. the capacitance may vary greatly with temperature changes, thus making it impossible to completely prevent oscillation. therefor e, use a tantalum aluminum electrolytic capacitor with a low esr (equivalent serial resi stance). the output will oscillate if the esr is too high or too low, so refer to the esr characteristcs in fig. 31 and operate the ic within the stable oper ating region. if there is a sudden load change, use a capacitor with higher capacitance. a capacitance between 10 ? f and 1,000 ? f is recommended. fig. 29 thermal derating curves fig. 30 BA3258HFP esr characteristics fig. 31 ba33d series esr ambient temperature ta ? 8 10 9 7 6 5 4 3 2 1 0 power dissipation pd w 25 50 75 100 125 150 board size: 70 mm ? 70 ? 1.6 mm (with a thermal via incorporated by the board) board surface area: 10.5 mm ? 10.5 mm (1) 2-layer board (backside copper foil area: 15 mm ? 15mm) (2) 2-layer board (backside copper foil area: 70 mm ? 70 mm) (3) 4-layer board (backside copper foil area: 70 mm ? 70mm) 0 io [ma] 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 esr [ ] 0.02 0.05 0.2 5.0 I 10.0 I 0.15 4.0 I 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 io [ma] esr [ ] I 0.02 0.05 0.2 5.0 I 10.0 (3) 7.3 w (2) 5.5 w (1) 2.3 w *vcc: applied voltage io1: load current on vo1 side io2: load current on vo2 side icc: circuit current * the icc (circuit current) varies with the load. (see reference data in figs. 2, 3, 14, and 15.) unstable region unstable region unstable region stable region stable region vo1 vo2 controlle r 3.3 v output vcc gnd vcc vcc power t r power tr 1.5 v output o r 1.8 v output i p icc i o1 i o2
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 7/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. notes for use 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rat ed values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3) thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pins are shorted together. 5) actions in strong electromagnetic field use caution when using the ic in the presence of a strong elec tromagnetic field as doing so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 7) regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent el ements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers wi th the n layers of other elem ents, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. 8) ground wiring pattern when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 9) thermal shutdown circuit (tsd) this ic incorporates a built-in thermal shutdown circuit for protection against thermal destruction. should the junction temperature (tj) reach t he thermal shutdown on temperature threshold, t he tsd will be activated, turning off all output power elements. the circuit will automatically reset once the ch ip's temperature tj drops below the threshold temperature. operation of the thermal sh utdown circuit presumes that the ic's absolute maximum ratings have been exceeded. application designs should never make use of the thermal shutdown circuit. 10) overcurrent protection circuit an overcurrent protection circuit is inco rporated in order to prevention destruction due to short-time overload currents. conti nued use of the protection circuits should be avoided. please note th at the current increases negativ ely impact the temperature. 11) damage to the internal circuit or element may occur when the polarity of the vcc pin is oppos ite to that of the other pins in applications. (i.e. vcc is shorted with the gnd pin while an ex ternal capacitor is charged.) use a maximum capacitance of 1000 mf for the output pins. inserting a diode to prevent back- current flow in series with vcc or bypass diodes between vcc and each pin is recommended. fig32 bypass diode f ig. 33 example of simple bipolar ic architecture vcc output pin diode for preventing back current flow bypass diode gnd p n p n n p p a ? gnd n p p b ??? ( npn ) b n e c gnd p transistor (npn) resistor pin a p substrate parasitic elements pin b n p n ( pin a ) gnd parasitic elements gnd (pin b) b c e parasitic elements or transistors x
BA3258HFP,ba33d 15hfp,ba33d18hfp technical note 8/8 www.rohm.com 2011.03 - rev.b ? 2011 rohm co., ltd. all rights reserved. ordering part number b a 3 5 2 8 h f p - t r part no. part no. 3528 33d15 33d18 package hfp:hrp5 packaging and forming specification tr: embossed tape and reel (hrp5) direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed 2000pcs tr ( ) the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand (unit : mm) hrp5 s 0.08 s (max 9.745 include burr) 5432 1 1.9050.1 0.8 350.2 1.5230.15 10.540.13 ?0.05 +0.1 0.27 4.5 (6.5) 8.82 0.1 9.3950.125 0.730.1 1.72 0.080.05 (7.49) 8.00.13 1.0170.2 1.2575 ?4.5 +5.5
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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